The BGA Reballing machine is a high-precision electronic component packaging equipment. It is mainly used to secure small BGA chips onto PCB substrates, facilitating electrical connections between the chip and the PCB. The BGA Reballing machine is primarily applied in the electronic component manufacturing industry. It can precisely solder small, high-density electronic chips, including memory…

There are different methods for BGA (Ball Grid Array) chip ball placement. Today, Silman Tech will explain that they can be classified into different categories: Machine ball placement involves setting up a program, and then the machine autonomously completes the BGA ball placement. The advantages of machine ball placement include high rework yield, saving on…

In SMT (Surface Mount Technology) assembly, it’s common to need rework on BGA (Ball Grid Array) chips. Repairing BGA chips is not a simple task, so it’s essential to master certain techniques for BGA soldering. BGA soldering can be categorized into several methods: manual soldering using a hot air gun or a BGA rework station,…

BGA rework is typically performed to remove components that are faulty, damaged, or incorrectly aligned, and to replace them with new components. The basic principle of manual rework is to handle the circuit board and components with care to avoid overheating, which could cause damage to the board’s plated through-holes, components, and solder pads. (I…

Choosing the right brand of BGA rework station may pose a challenge for those who are new to BGA rework equipment. To select a high-quality and practical BGA rework device, it is essential to understand several factors, such as whether a three-zone or two-zone system is preferable, the size of the PCBA boards you need…