There is a common misconception that cleaning circuit boards after soldering is merely for aesthetic purposes, with no other significant benefits. However, neglecting cleaning during the PCBA (Printed Circuit Board Assembly) manufacturing process can lead to various issues, causing operational costs to skyrocket due to faults, rework, or product recalls during long-term customer use. Let’s…

With the development of SMT, the trend towards miniaturization and high-density assembly of components has emerged. Consequently, SMT pick-and-place machine nozzles have become more precise and have a greater impact on assembly quality. During actual assembly processes, nozzle blockages due to solder, flux, or other contaminants can lead to component misplacement. Previous methods such as…

Liquid addition Liquid addition includes three types of actions: adding cleaning solution at the beginning of the cleaning process, replenishing during the cleaning process, and replacing the cleaning solution. Considerations during liquid addition include: Cleaning Drying The spray cleaning process generally adopts ambient temperature airflow for drying, with the drying time adjusted according to the…

PCB cleaning agents, also referred to as washing solutions, serve the same purpose of cleaning PCBAs (Printed Circuit Board Assemblies). The choice between solvent-based and water-based cleaning materials depends on various factors, with each type having its own advantages and disadvantages. Solvent-based cleaning agents used for PCBA cleaning can be categorized into hydrocarbon solvents, halogenated…

The current situation of traditional ink, adhesive, silver paste, and silicone rubber PCB cleaning present three major problems: large consumption of cleaning solution, inadequate workplace to meet environmental protection standards, and reluctance of workers to manually clean PCBs. Traditional cleaning methods for ink, adhesive, silver paste, and silicone rubber PCBs typically involve manual wiping with…

The traditional manual cleaning process for screen printing screens involves dipping cloth strips into cleaning solution or anti-white water for scrubbing, typically cleaning one side before proceeding to the other. However, this process poses several challenges and issues: Many companies have been aware of these issues for many years, especially those that prioritize quality and…

In simple terms, the effects of the stencil on SMT printing defects mainly come from seven aspects: stencil thickness, number of apertures (either too many or too few), aperture position, aperture size, aperture shape, roughness of the aperture walls, and cleanliness of the apertures after stencil use. Let’s elaborate on each of these: To control…

The pick-and-place machine nozzles play a significant role in the placement rate (SMT placement rate) in PCB manufacturing companies. Many people value the SMT placement rate because it not only affects the production cost of the production line but also influences the operational efficiency of the production workshop. Let’s briefly introduce how nozzles affect the…