With the allocation of Silman Tech’s automatic BGA rework station completed, BGA soldering and rework experiments are about to commence. Today, as a representative of Silman Tech’s BGA rework station manufacturer, based on some previous practical activities in this area, I would like to share some techniques and methods for BGA soldering with you. Your…
It is well known that in the BGA chip rework process, there are three key factors directly affecting the success rate of BGA rework: placement accuracy, precise temperature control, and prevention of PCB deformation. Apart from these, there are other factors as well, but these three are particularly crucial and challenging to manage. Let’s delve…
As the use of nozzles becomes increasingly widespread and nozzles become miniaturized, traditional ultrasonic nozzle cleaning methods are no longer sufficient to ensure the cleanliness of the nozzles. Consequently, a large number of nozzle cleaning machines have emerged, with significant differences in performance and prices among various brands. For many newcomers, they may initially focus…
When it comes to repairing the CPU in a laptop, it’s essential to determine whether the CPU is packaged using PGA (Pin Grid Array) or BGA (Ball Grid Array) technology. Here’s how you can determine: Currently, laptops on the market typically use PGA and BGA packaging. PGA packaging features pins (made of alloy material, resistant…
When purchasing a BGA automatic ball bonding (ABB) machine, several factors need consideration beyond just the cost. Here are some important points to keep in mind: For example, Silman Tech offers high-quality BGA ABB machines capable of handling various chip types with ball bonding capabilities ranging from 0.2mm to 0.76mm. Such a machine can effectively…
Selecting the right BGA rework station that meets your needs can greatly enhance your efficiency. If you are procuring a BGA rework station for a company, your primary consideration should be how to reduce costs. Here, cost does not only refer to the equipment cost but also includes time, labor, and the cost associated with…
Can a high-precision BGA rework station repair irregularly shaped BGA chips? The first step is to understand the main reasons for irregularly shaped BGA chips. Different types of anomalies require different repair methods. Of course, if the high-precision BGA rework station you are using has a wide range of capabilities, it can indeed repair irregularly…
The process of BGA rework on a motherboard involves several complex steps that must be strictly followed to ensure successful rework. Let’s delve into the specific methodological steps for BGA rework on motherboards, as detailed by Silman Tech, a manufacturer of BGA rework stations. If you lack experience or require high precision due to large…
In the BGA rework industry, professionals understand that temperature plays a crucial role during BGA rework, and the temperature profile directly affects the success rate of BGA chip rework. Here’s a personal suggestion from me: when setting the temperature profile for a BGA rework station, it’s advisable to start with a preheat at 190 degrees…
BGA (Ball Grid Array) chips are precision electronic components, and improper ball attach methods can easily lead to rework failure. Employing the right ball attach method is crucial for enhancing the reliability, safety, and stability of BGA chips. Here are several common methods for BGA ball attach: These are the methods for BGA ball attach,…
