The functions of high-precision BGA rework stations and ordinary BGA rework stations are basically similar. The advantage of high-precision BGA rework stations over ordinary ones lies in their ability to repair highly accurate BGA chips. The main reason why ordinary BGA rework stations cannot achieve high-precision BGA rework is that they cannot reach the temperature setting requirements for reworking closely spaced BGA chips. Silman Tech BGA rework station DEZ-R880A is recommended, as it offers high precision compared to ordinary BGA rework stations.
The high-precision BGA rework station ensures that the temperature difference between adjacent BGAs is normal, usually around 183°C. Such a significant temperature difference cannot be achieved by ordinary BGA rework stations.
Compared to ordinary BGA rework stations, high-precision BGA rework stations offer more precise and convenient temperature settings. When soldering BGAs, the greatest advantage of high-precision BGA rework stations is the ability to precisely set the temperature curve. The temperature curve can be precisely set according to the size of the chip, the type of solder paste, and other factors. During the heating process, the Станция доработки BGA goes through stages of preheating, temperature rise, solder melting, and cooling. The temperature curve setting varies at each stage and is crucial for achieving optimal soldering results.
For the repair of high-precision BGA chips, temperature settings need to be adjusted based on chip type, temperature program, etc. High-precision BGA rework stations use controlled heating elements to adjust airflow and achieve uniform heating, ensuring that the temperature reaches each part of the BGA chip evenly.
When repairing a new BGA chip without knowing its temperature resistance, a high-precision BGA rework station allows for careful temperature monitoring and adjustment. By observing the melting degree of the solder balls and testing their mobility, the temperature can be accurately set.
In summary, high-precision BGA rework stations are necessary for repairing closely spaced BGA chips due to their ability to provide precise temperature control and accommodate different chip sizes and types. Ordinary BGA rework stations lack the precision and temperature control required for such tasks. Additionally, high-precision BGA rework stations are equipped with three independent heating systems for optimal temperature control, making them superior to ordinary ones in terms of performance and design, albeit at a higher price point.
