Aperçu
ST-U300 ultrasonic aluminum wire bonding machine (wire bonding machine) is a device that uses fine aluminum wire and pressure and ultrasonic energy to tightly bond the aluminum wire to the substrate pads, achieving electrical interconnection between chips and substrates and information communication between chips. It is also one of the core pieces of equipment in electronic micro-assembly processes. Furthermore, it is a precision circuit board (COB) back-end welding production equipment, primarily used for welding internal leads of semiconductor devices such as digital tubes, dot matrix displays, integrated circuit soft packages, thick-film integrated circuits, and transistors.
Name: ST-U300 Ultrasonic Aluminum Wire Bonding Machine (Wire Bonding Machine)
Model: ST-U300
Brand: Silman
Origin: Shenzhen
Description: Stable performance, easy to operate and maintain, compact design, a small desktop device ideal for laboratory use.
The welding head frame of this machine adopts a vertical guide rail up-and-down movement mode (Z-axis movement), while the second welding movement (span) is achieved through the horizontal guide rail movement of the welding head frame (Y-axis movement). Both movements are driven by imported stepper motors. Therefore, the aiming height, wire arching height, and jumper distance of the first and second welding can be truly digitally controlled, thus ensuring stable welding quality, precise weld point control, high weld line repeatability, and good wire arching height consistency. The second welding point of this machine can be set to automatic welding. The operator only needs to press the welding button on the control box to complete the entire welding process according to the parameters set by the operator, making the welding speed faster and significantly increasing the output per shift.
Application Areas:
Microwave devices, RF modules, hybrid circuits, MEMS circuits, optoelectronic devices, sensors, nanodevices, semiconductor devices, radar devices, military devices, application-specific circuits, COB/SOB, etc.
Application Industries:
Optoelectronic companies, discrete electronics companies, research institutes, university laboratories, and other R&D and manufacturing units.
| Modèle d'appareil | ST-U300 |
|---|---|
| electric requiement | 220VAC±10％、50HZ、be sure connected to ground |
| aluminium wire diameter： | 75～500μm (3～20mil) |
| ultrasonic power： | 0－30W, two channel.can be set separately of the two point |
| bond time： point | 10－500ms，two channel |
| bond force: | 30－1200g，two channel |
| motorized Y： | 0－18mm |
| microscope rate： | 7.5 and 15 |
| working area： | Φ25mm |
| light： | adjustable brightness |
| size： | 620×610×560mm |
| weight： | 40kg |