Some large manufacturers of BGA rework stations include Silman Tech. Customers who have used Silman Tech’s automated BGA rework stations understand that they are not only durable but also highly efficient. When purchasing a large BGA rework station for a medium to large-sized enterprise, it is essential to carefully consider a manufacturer like Silman Tech…
Screen printing screens, which are used in the screen printing process to produce desired graphics, are composed of mesh fabric, aluminum frames, and graphics. Despite the rapid advancement of light industry and the electronics industry, screen printing remains an indispensable production process. Screen printing is widely used in various everyday products, and the core product…
Over-oven fixtures are commonly used in the electronics industry as fixtures for SMT (Surface Mount Technology) processing of PCB (Printed Circuit Board) assemblies. They are primarily used for PCBs with SMD (Surface Mount Device) components soldered on top of through-hole components. The materials used for over-oven fixtures include: Features and applications of over-oven fixtures include:
(1) Atmospheric Pressure and Atmospheric Pressure: According to the principles of fluid mechanics, all objects in the Earth’s atmosphere are subject to the force of gravity of the air, which is the atmospheric pressure. The atmospheric pressure acting on a unit area is the atmospheric pressure. The standard atmospheric pressure at sea level (1 atm)…
As we all know, there are various types of nozzles for SMT pick and place machines available on the market, categorized by materials such as tungsten steel, diamond steel, ceramic, plastic, aluminum, and iron. They also vary in shape, including round, square, V-shaped, and more. Choosing the appropriate nozzles can be a challenge for many…
The difference lies in their characteristics. QFN solder paste is specially formulated to address common issues encountered during SMT assembly with QFN components, such as inadequate soldering on the side, difficulty soldering on partially oxidized PCB pads, and challenges in soldering to the component itself. It offers excellent printability, even for IC pads with a…
In today’s electronic device manufacturing processes, many factories use lead-free solder flux composed mainly of rosin, resin, halogen-containing activators, additives, and organic solvents. While such fluxes offer good solderability and low cost, they leave behind high levels of residues after soldering. These residues contain halide ions, which gradually decrease electrical insulation performance and may lead…
Jigs and fixtures, despite the mere difference of a single letter, are often confused and sometimes misused. So, what exactly distinguishes a test fixture from a jig? Let Silman Tech elaborate on this in detail. Types of Jigs: Jigs can be classified into three main categories: process assembly jigs, project testing jigs, and PCB testing…
The BGA Reballing machine is a high-precision electronic component packaging equipment. It is mainly used to secure small BGA chips onto PCB substrates, facilitating electrical connections between the chip and the PCB. The BGA Reballing machine is primarily applied in the electronic component manufacturing industry. It can precisely solder small, high-density electronic chips, including memory…
There are different methods for BGA (Ball Grid Array) chip ball placement. Today, Silman Tech will explain that they can be classified into different categories: Machine ball placement involves setting up a program, and then the machine autonomously completes the BGA ball placement. The advantages of machine ball placement include high rework yield, saving on…
