Judging the quality of a BGA rework station depends on several factors, mainly the quality of its hardware components. Here’s how to determine the quality: By adhering to the above criteria when selecting a BGA rework station, it’s not difficult to choose a high-quality device. If there’s a purchase requirement, customers can contact the website’s…

The initial cost of purchasing BGA rework station equipment ranges from tens of thousands to over a million. However, the maintenance costs in the long term can also be significant. So, how can one reduce the maintenance costs of BGA rework station equipment? Firstly, as a manufacturer of BGA rework stations, strict control over the…

The temperature profile is a crucial factor for successful BGA chip rework on a BGA rework station. Compared to conventional reflow soldering temperature profiles, the temperature control requirements during BGA rework operations are higher. Typically, the temperature profile for BGA rework can be divided into six parts: preheating, heating, soak, melting, reflow, and cooling. Here’s…

Determining the quality of a BGA rework station, also known as a BGA rework system, can be a challenging task for consumers unfamiliar with the BGA rework industry. Below are specific criteria to consider when judging the quality of a BGA rework station: By adhering to these standardized criteria, customers can easily purchase high-quality BGA…

The range of BGA rework stations includes various packaged chips for BGA chip repair. BGA (Ball Grid Array) technology enhances the functionality of digital electronic products and reduces product size through a grid array structure. Digital electronic products encapsulated through BGA technology share common characteristics of small size, strong functionality, low cost, and practicality. A…

The automation level of BGA rework stations directly affects the efficiency of rework. With the increasing density of chip industry, the manufacturing industry of BGA rework equipment faces great challenges. Some manual and semi-automatic BGA rework stations cannot achieve the high precision required for BGA chip rework. This is where the need for automated BGA…

BGA chips are packaged using a ball grid array (BGA) technique, where the I/O terminals are arrayed in circular or column-shaped solder balls under the package. The application of BGA technology increases the functionality of digital electronic products while reducing their size. However, the densely packed nature of BGA chips makes their removal quite challenging.…