There are several types of BGA preheating stations with different heating methods available on the market:
- Dual-zone hot air circulation: Both upper and lower zones use hot air circulation for heating. This method offers fast heating and cooling, precise temperature control compared to infrared heating, and no special requirements for the color of the PCB substrate. However, it may have temperature differences within the chamber and weaker penetration and sustained heating capabilities.
- Infrared heating: Both upper and lower zones utilize infrared heating. This method offers continuous heating and good penetration capabilities. However, it requires specific PCB substrate colors and may have slower heating rates, resulting in lower repair efficiency.
- Combination of hot air and infrared: Hot air heating is used in the upper zone, while infrared heating assists in the lower zone. This method combines the advantages of fast hot air heating and continuous infrared heating, improving repair efficiency. However, it may struggle with controlling bottom-side temperature for complex BGA chips.
- Microcirculation hot air with infrared three-zone heating: This method utilizes microcirculation hot air in the upper and lower zones, supplemented by a large-area infrared three-zone heating in the middle. It offers accelerated temperature rise and fall rates, continuous heating, and significantly improved repair success rate and efficiency. However, it may come at a higher price compared to other methods.
Each heating method has its advantages and disadvantages, and the choice depends on factors such as repair requirements, PCB substrate characteristics, and budget considerations. For those interested in purchasing a BGA preheating station, Silman Tech offers a range of options, including fully automatic preheating stations tailored for EMS manufacturers, ensuring quality and customer satisfaction. You may also be interested in BGA rework stations.