Reworking fine-pitch BGA chips, typically referring to chips with adjacent BGAs spaced less than 0.5mm apart, such as Chip0201/01005 chips, presents significant challenges due to their high density. Inaccurate temperature control during rework can easily lead to damage to surrounding BGAs. So, how can we effectively remove and solder fine-pitch BGA chips? Here are the steps and methods compiled by Silman Tech, along with instructional videos on BGA rework using a BGA rework station.
Method Steps for Removing and Soldering Fine-Pitch BGA Chips:
- Preparation: Prepare a BGA rework station, the fine-pitch BGA chip for rework, tools such as a microscope and solder paste. Silman Tech recommends using the DEZ-R880A fully automatic BGA rework station for efficient removal and soldering of Chip01005 chips. This machine ensures quick and precise operations, particularly important for achieving high rework success rates.
- Fixation: Secure the Chip01005 in the controlled temperature zone. The DEZ-R880A features a flexible PCBA placement platform with adjustable angles and heating areas, suitable for any PCB size or shape. Ensure that the chip is securely held in place to prevent dislodging during heating.
- Temperature Curve Adjustment: Power on the BGA rework station and adjust the temperature curve suitable for removal. The DEZ-R880A can quickly generate an ideal rework temperature curve, which can be fine-tuned as needed to ensure precise temperature control throughout the rework process.
- Heating: Raise the bottom micro-hot air heater to align with the position of the BGA chip. Take care to avoid collisions with taller components on the PCB to prevent damage to the BGA chip. Once the position is adjusted, initiate heating to remove the BGA chip. After a set period, the machine will automatically remove the chip.
- Alignment and Soldering: Following removal, the machine will proceed to align and re-solder the new BGA chip. Once alignment is completed, the machine will initiate soldering. The entire rework process is now complete.
These steps outline the process for reworking fine-pitch BGA chips using a BGA rework station. If further clarification is needed, instructional videos provided by Silman Tech can offer additional guidance on both removal and soldering processes.