The formation of BGA solder voids can lead to current concentration effects and reduce the mechanical strength of solder joints. Therefore, from a reliability perspective, it is necessary to reduce or minimize solder voids. To answer this question, it is necessary to explore the causes of void formation. There are various reasons for the formation…
BGA (Ball Grid Array) utilizes solder balls on the entire bottom to connect with the circuit board, greatly increasing the equipment’s I/O count, shortening signal transmission paths, and exhibiting excellent heat dissipation performance. Due to its short leads, BGA has low inductance and mutual inductance between wires, resulting in good frequency characteristics. During reflow soldering,…
Many users may have a doubt when they first encounter BGA rework stations: what are the differences between a conventional BGA rework station and a high-precision optical BGA rework station? Let’s start with two concepts from Baidu. Optical alignment—utilizing an optical module with a prism imaging method, LED lighting, adjusting the light field distribution to…
Selective wave soldering is an advanced surface mount technology widely used in the electronics industry for connecting electronic components to circuit boards. It employs lead-free soldering methods and utilizes optical recognition systems, control systems, and computer software to complete the soldering process. This technology is suitable for installing miniature electronic components on smaller circuit boards.…
Selective wave soldering, also known as “selective soldering,” is an advanced electronic assembly soldering technique. It utilizes robots and computer-controlled equipment to apply solder material only to the electronic components requiring soldering, with high-speed operation without preheating and manual solder coating. In comparison to traditional wave soldering techniques, selective wave soldering offers more prominent advantages…
Solder balls refer to small spherical substances formed when solder is extruded between the solder pad and component lead during the wave soldering process. Silman Tech here shares with you the reasons for solder ball formation in wave soldering and preventive measures. Firstly, the reasons for solder ball formation are as follows: To prevent solder…
Printing screens made of ink (also known as ink screen) are vital instruments in printing to transfer ink onto printed materials uniformly. Normally, ink screens can be used again even though this relies on several aspects: Ink screens usually have metal or polymer compositions. Metal ones such as stainless steel are long-lasting and reusable more…
The role of Surface Mount Technology (SMT) in the process of solder paste printing in SMT assembly is important. In this case, the scraper blade plays an important part when using automatic printing machines for solder paste printing. Here are a few techniques to adjust and prepare scraper blades for SMT placement that may be…
عزيزي الجميع، 29 سبتمبر - 5 أكتوبر. إنه مهرجان منتصف الخريف التقليدي والأعياد الوطنية. سيستأنف فريق سيلمان العمل في 6 أكتوبر 2023. يُطلق على مهرجان منتصف الخريف أيضًا اسم مهرجان القمر أو مهرجان كعكة القمر. ويصادف تقليديًا اليوم الخامس عشر من الشهر الثامن من التقويم القمري الصيني.
شحن آلة Silman BGA / آلة الليزر إلى ليبيا لمتجر إصلاح اللوحات.
