The basic principle of BGA (Ball Grid Array) reballing process is to use spherical solder balls to connect the chip and the printed circuit board (PCB). In this process, a certain number of solder balls are first prepared, typically made of tin-lead alloy. These solder balls are then attached to the chip’s solder pads, and the chip is positioned onto the corresponding location on the PCB using a positioning device. Finally, heating equipment is used to melt the solder balls, allowing them to bond with the solder pads on the PCB, thus establishing the connection between the chip and the PCB.
The advantages and disadvantages of BGA reballing process: Compared to traditional DIP (Dual In-line Package) packaging, the BGA reballing process offers advantages such as high reliability of connection, smaller size, and faster signal transmission speed. Due to the larger soldering area and more uniform distribution of solder points, the connection between the chip and the PCB is more robust and reliable. Additionally, BGA packaging features smaller package volume and shorter signal transmission distances, effectively reducing signal transmission delays and improving system efficiency. However, the BGA reballing process also has some disadvantages, such as high cost, difficulty in maintenance, and high process requirements.
The application of BGA reballing process is widespread. In the computer field, BGA reballing technology is widely used in the packaging of high-performance chips such as CPUs and GPUs. In the communication field, BGA reballing technology is extensively used in equipment such as base stations and routers. In the consumer electronics sector, BGA reballing technology finds broad application in electronic products such as smartphones and tablets. With the development of electronic products towards lightweight, high-performance trends, the application prospects of BGA reballing technology will become increasingly extensive.
