There are several common methods for BGA (Ball Grid Array) chip reballing, which is a technique mainly used in the field of electronic component soldering for connecting IC chips to PCB boards. Here are a few of them:
- Manual Reballing: Specialized handheld hot air guns and suction pens are used to place a hollow syringe or grid pre-filled with solder balls at the positions of the chip’s pins. Then, the hot air gun is used to heat and melt the solder balls, which adhere to the chip’s pins.
- Automatic reballing Machine: An automatic reballing machine mechanically places solder balls individually and accurately onto the chip’s pin positions. This method is suitable for mass production, as it can improve production efficiency and accuracy.
- Vision-Based reballing: A layer of transparent adhesive is pre-coated on the BGA solder pads, and high-precision positioning of the pads is achieved through a vision-based system. Then, solder balls are installed using an automatic ball mounting machine or manual reballing method.
It is important to note that precise operational techniques and control parameters are required for BGA chip reballing to ensure accurate ball positioning and good quality. In specific applications, suitable reballing methods should be chosen based on different circumstances, and operations should comply with relevant process requirements.