With the rapid development of various smart terminal devices (such as smartphones and iPads) and electronic products for smart cars, the miniaturization of packaging and assembly, as well as various new packaging technologies, have become increasingly complex, and the quality requirements have also been elevated. The precision of circuit components is also increasing, posing higher demands on factory inspections. Even the slightest error can lead to fatal damage to the product, necessitating new inspection technologies.
To reduce product defects and ensure yield, many companies engaged in electronic manufacturing actively seek industrial testing applications centered around testing and measurement technology, providing strong support for products. Testing and measurement technology has rapidly developed, playing a role in “inspection and debugging” in the electronic manufacturing industry product line.
Nowadays, in the SMT electronic manufacturing industry, circuit components utilize more BGAs and other devices with hidden solder connections, and there is a continuing trend towards smaller and denser components. The demand for accuracy, precision, and efficiency in detection is also increasing. Relying on manual visual inspection to identify products is challenging to adapt to the current fast-paced automated assembly lines, especially considering the low labor cost and detection efficiency, as well as the limitations of detection.
Mature key process detection and control technologies greatly enhance companies’ confidence in the quality of finished products. Traditional testing and measurement techniques typically only obtain surface information of the product, making it difficult to provide complete internal information. X-ray inspection technology, as an emerging process and analysis method, can detect hidden defects invisible to the naked eye without affecting the product’s appearance, reflect internal information of the product, and enable qualitative and quantitative analysis of the inspection results to detect failures early and reduce scrap rates.
