BGA chips are packaged using a ball grid array (BGA) technique, where the I/O terminals are arrayed in circular or column-shaped solder balls under the package. The application of BGA technology increases the functionality of digital electronic products while reducing their size. However, the densely packed nature of Микросхемы BGA makes their removal quite challenging. So, what tools are best for removing BGA chips? Certainly, specialized BGA rework stations are required.
A BGA rework station is a repair machine that primarily uses hot air circulation and infrared assistance for heating. It boasts high precision and flexibility, making it suitable for repairing various components such as BGAs, CSPs, PoPs, PTHs, WLCSPs, QFNs, Chip0201/01005, shielding frames, modules, and more, on PCBA boards found in servers, PC motherboards, tablets, smart terminals, and other electronic devices.
Setting the temperature curve is crucial, as it is well known that brute force alone cannot remove chips. Proper temperature heating is essential for chip removal, with different temperature standards required for different durations. Therefore, to successfully remove BGA chips, precise temperature settings are necessary. Once all these steps are prepared, the next step is to securely fix the chip to the fixture of the BGA rework station.
After securing the chip, the next step is to perform alignment on the chip to be removed. Silman Tech’s Станция доработки BGA employs an advanced RGBW imaging system that can match different motherboard colors to facilitate alignment, effectively reducing rework time. Additionally, the equipment incorporates multiple safety protection features to prevent accidents. Then, simply press the start button on the BGA rework station, and the equipment will heat up according to the pre-set temperature curve. After a period of time, the equipment will automatically determine whether the BGA chip can be removed. Once the dismantling temperature curve is completed, the BGA rework station automatically removes the damaged BGA chip and places it in the waste bin.
At this point, the BGA chip can be removed. After discussing the removal of BGA chips, the next step is to solder the intact BGA chip back in place. The process is similar to the steps for chip removal mentioned above. The method described above is one of the fastest and most successful ways to remove BGA chips. Silman Tech’s BGA rework station utilizes automatic dismantling and mounting processes, reducing manual intervention and labor costs while increasing repair qualification rates. With Silman Tech’s BGA rework station, the qualification rate for removed BGA chips can reach 99%, compared to manual dismantling, which typically yields a qualification rate of around 50%.
Therefore, I recommend using an automatic BGA rework station, if economically feasible. This ensures work efficiency and a high success rate for repairs. Regarding the question of what tools are best for dismantling BGA chips, that concludes the discussion. If there are any uncertainties, you can contact customer service on this website.
