With the advancement of electronic technology, there is an increasing demand for electronic products with higher functionality and smaller form factors. Electronic components are evolving towards miniaturization, integration, and multifunctionality. Ball Grid Array (BGA) components meet these requirements and are widely used, especially in high-end electronic products.
When soldering BGA components, voids are inevitably generated. Voids in BGA solder joints can reduce the mechanical strength, affect the reliability and lifespan of the solder joints, and thus it is necessary to control the occurrence of voids. In solder joint quality standards, voids play a decisive role in quality, especially in large solder joints where the area can reach 25 square centimeters, making it difficult to control changes in enclosed gas within the cavity. Commonly, the size and location of voids remaining in the solder vary. Thermally, voids can lead to module failure and even cause damage during normal operation. Therefore, quality control is absolutely necessary in the production process.
Currently, it is difficult to find voids after the soldering process is completed. Even with comprehensive testing during production, the choice of testing techniques is limited. X-ray inspection technology has proven to be effective in the analysis of solder joints in electronic components and has been widely used for quality control in online production. X-rays can penetrate the package and directly detect the quality of solder joints. As the packaging methods of current semiconductor product components are becoming smaller, better Оборудование для рентгеновского контроля is required to ensure the needs of miniaturized component detection.
Silman Tech’s X-ray inspection equipment is particularly suitable for the detection of solder joints in IC components. Its X-ray inspection features high-definition imaging and analysis of defects such as open circuits, short circuits, and solder bridging. With sufficient magnification, producers can easily view detailed product defects to meet current and future demands.
