Auxiliary materials for BGA rework stations are essential for ремонт микросхем BGA. During the soldering process, we inevitably need to handle tasks such as ball planting. Below are several commonly used consumable tools:
- Flux Paste
Flux paste plays a significant role in the soldering process. Whether it’s re-soldering or direct soldering, we need to apply flux paste first. When soldering chips, use a small brush to thinly coat the clean solder pads, ensuring uniform application. Avoid applying too much flux, as it can affect soldering. When soldering, dip a small amount of flux paste with a brush and apply it around the chip.
- Solder Balls
Currently, solder balls commonly used come in three diameters: 0.30mm, 0.45mm, and 0.6mm. The 0.6mm diameter solder balls are mainly used for the main chips in MS99 processors, while the 0.25mm diameter solder balls are used for EMMC program ICs. For other components like DDR or main chips, the recommended diameter is 0.45mm (though 0.4mm can also be used). It is advisable to use leaded solder balls as they are easier to solder.
- Stencil
Stencil. Due to the limitations of chip universality, a universal stencil is used. Typically, we use stencils with a hole diameter of 0.5mm and a pitch of 0.8mm, or a hole diameter of 0.6mm with the same pitch.
- Reballing Station
Ball planting station. There are various types of ball planting stations, but I recommend using a simple ball planting station with direct heating. This type of station is cost-effective and easy to operate.
