Principle and Application of Automatic Soldering Device - SilmanTech - Cof Bonding Machine, BGA rework, X-ray inspection, Glue dispensing Machine

With the rapid development of industry and the increase in production costs, improving production efficiency has become imperative. Printing is the first step in making a good product, making the introduction of automatic soldering devices a trend. Below is a brief explanation of the principle and application of automatic soldering devices.

Principle: The system consists of an electronic control section and a mechanical fixing device. The motor drives the screw rod to move a specified distance, squeezing the solder paste out of the solder paste bottle and cutting it off with a blade. The system collects the printing times through the sensing device, and the control system sets the program to control the solenoid valve to automatically add solder paste to the printer, warning in advance of the remaining solder paste.

Application: It automates the process of periodic solder paste addition, reduces personnel involvement in this step, and reduces the occurrence of poor printing due to insufficient solder paste. It also reduces the time and losses associated with solder paste addition. This improves production efficiency. Generally, the automatic soldering device of the printer adopts pneumatic or electric motor mechanism. After fixing the solder paste bottle and setting the amount and time of each solder paste addition, the automatic soldering device will add solder paste sequentially according to the number of PCBs printed. This ensures that the total amount of solder paste on the stencil remains within a reasonable range. Stable solder volume, steady cycle. No need for downtime operation, which improves efficiency, saves time, reduces solder paste consumption, and reduces labor costs. It also plays a crucial role in the maintenance of the printer to ensure its optimal operation.

Princípio e aplicação do dispositivo de soldadura automática

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