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X-ray Inspection System X7600

Overview Semi-automated x-ray inspection system for none destruction inspection of SMD, BGA, QFP, CSP, sockets, Micro-SMD components solder joints, material quality etc. FeaturesSpecificationOptional PartsGet a QuoteFeatures X-ray Inspection System X7600 SMT/Semicon/Solar/Connector/LED High-definition image: Slanting/Bridge/Voids/Cold Solder/Bonding wire 90KV 3μm (130 KV Optional)closed X-ray tube,long life time,maintenance in free 2.3 mllion high resolution digital flat panel detector 6…

X-ray Inspection System X5600

Xray Inspection SystemBy Andy February 12, 2019

Overview Semi-automated x-ray inspection system for none destruction inspection of SMD, BGA, QFP, CSP, sockets, Micro-SMD components solder joints, material quality etc. FeaturesSpecificationOptional PartsGet a QuoteFeatures X-ray Inspection System X5600 SMT/Semicon/Solar/Connector/LED IC/PCB High-definition image: Slanting/Bridge/Voids/Cold Solder/Bonding wire 90KV 15 um closed X-ray tube,with long life,maintenance in free 1.3million high resolution digital flat panel detector Color image…

ST-R8650A Automated Rework System

BGA Rework StationBy Andy February 12, 2019

Overview Fully automated rework system for normal SMD, BGA, QFP, CSP, sockets, Micro-SMD components etc. Support Min. SMD Size 10mm * 10mm. FeaturesSpecificationOptional PartsGet a QuoteFeatures ZM-R8650 BGA Rework System Stable and Uniform Hot Air Heating System Lower Heater Adjustable Extreme Large Carbon Fiber Infrared Pre-heater High-Precision PID Temperature Control System Industrial High-Definition CCD (2 x 5.0 MP)…

ST-R6823 Rework Station

BGA Rework StationBy Andy February 12, 2019

Overview Semi-automated rework system for normal SMD, BGA, QFP, CSP, sockets, Micro-SMD components etc. Support chips size Max. 80mm x 80mm, Min. 0.5mm * 0.5mm. PCB motherboard Max. 640mm x 520mm. FeaturesSpecificationOptional PartsGet a QuoteFeatures The ST-R6823 SMD / BGA Rework Stations feature the latest vision and thermal process control technologies. Printed circuit boards and substrates consisting of…

ST-R610 Rework Station

BGA Rework StationBy Andy February 12, 2019

Overview entry level rework system for normal SMD, BGA, QFP, CSP, sockets, Micro-SMD components etc. Support chips size Max. 80mm x 80mm, Min. 3mm * 3mm. PCB motherboard Max. 620mm x 520mm FeaturesSpecificationOptional PartsGet a QuoteFeatures Stable and Uniform Hot Air Heating System Lower Heater Adjustable(Height Moving Range 3CM) Ceramic honeycomb Infrared Preheater(Left/ Right Moving…

ST-R850 Rework Station

BGA Rework StationBy Andy February 12, 2019

Overview Automatic model SMD / BGA Rework Stations support printed circuit boards and substrates consisting of components such as BGA’s, CSP’s, QFN’s, Flip Chips, Min. 5mm * 5mm IC. FeaturesSpecificationOptional PartsGet a QuoteFeatures The ST-R850 BGA Rework Station High automatic rework Stable Hot Air Heating System Lower Heater Adjustable Carbon Fiber Infrared Pre-heater HD Touch Screen HMI…

ST-R820 Rework Station

BGA Rework StationBy Andy February 12, 2019

Overview Semi-automated rework system for normal SMD, BGA, QFP, CSP, sockets, Micro-SMD components etc. FeaturesSpecificationOptional PartsGet a QuoteFeatures The ST-R820 SMD / BGA Rework Stations feature the latest vision and thermal process control technologies. Printed circuit boards and substrates consisting of components such as BGA’s, CSP’s, QFN’s, Flip Chips, Support P08 Small pitch LED beads, Min. 2mm * 2mm IC. Stable…

LCD COF Bonding Machine ST-B100

COF Bonding MachineBy Andy February 4, 2019

Overview Semi-automated ACF COF Bonding Machine for LCD Tab, COF IC, Flexible Cable bonding. FeaturesSpecificationOptional PartsGet a QuoteFeatures LCD Flex-Cable COF ACF Bonding Machine – for COF/TAB Repair 1, PLC control, pulse heating mode, combined with titanium alloy extrusion head, rapid heating and rapid cooling, can be set up four heating, accurate temperature control. 2, 5.7…

X-ray Inspection System ST-X6600

Xray Inspection SystemBy Andy February 4, 2019

Overview Semi-automated rework x-ray system for none destruction inspection of SMD, BGA, QFP, CSP, sockets, Micro-SMD components solder joints, material quality etc. FeaturesSpecificationOptional PartsGet a QuoteFeatures X-ray Inspection System X6600 SMT/Semicon/Solar/Connector/LED High-definition image: Slanting/Bridge/Voids/Cold Solder/Bonding wire 90KV 5μm closed X-ray tube,with long life,maintenance in free 1.3 mp digital flat panel detector 30 degrees observation Color image…

Ultrasonic Cleaning Machine-JP008

Ultrasonic CleaningBy Andy February 4, 2019

Overview Ultrasonic cleaning machine for PCB circuit board repair, electronics, hardware etc FeaturesSpecificationOptional PartsGet a QuoteFeatures 1, Digital display Digital ultrasonic cleaning machine is better than mechanical rotary knob control, convenient operation, precise and durable. 2, Automatic protection heating JP008 with heat protection function, normal temperature to 65 degrees adjustable temperature, when the temperature rose to 65…