Use X-RAY to detect the effects of different packaged chips - SilmanTech - Cof Bonding Machine, BGA rework, X-ray inspection, Glue dispensing Machine

L'immagine a raggi X di un chip dual in-line package (DIP) rivela chiaramente la struttura complessiva: le parti più scure nelle file superiore e inferiore rappresentano i pin esterni del chip, mentre il quadrato con i punti neri al centro raffigura il chip e il suo die, circondato da fili sottili radiali che...
In the X-ray image of a dual in-line package (DIP) chip, the wider shadow between the pins and bonding wires indicates the extended portion of the chip pins within the package.
After removing the packaging of the dual in-line package (DIP) chip, the die is exposed, surrounded by radial golden wires which are pure gold bonding wires connecting the die to the chip pins.
The X-ray image of a chip.
Image of the die exposed after removing the packaging of the chip, showing the golden bonding wires.
X-ray image of a ball grid array (BGA) packaged chip.
X-ray image of a BGA packaged chip.
X-ray image of a commonly used SDRAM chip, where the chip pins and bonding wires are clearly visible.
X-ray image of a 64-pin thin quad flat package (TQFP) packaged chip, with the die, pins, and bonding wires clearly visible.
Actual view of a 64-pin thin quad flat package (TQFP) packaged chip.
X-ray image of a gas discharge tube.
X-ray image of a NAND flash chip packaged in a surface-mount TSOPI-48 package, with the internal structure clearly visible.
X-ray image of a surface-mount PQFP-128 packaged chip.
X-ray image of a NAND flash chip packaged in a surface-mount TSOPI-48 package.
X-ray image of a surface-mount TSSOP-48 packaged chip, showing the chip pins, bonding wires, base holding the die, and die from outside to inside.
Image of the die under a microscope after removing the packaging of a surface-mount TSSOP-48 packaged chip, with black stripe-like parts around indicating the bonding wires.
X-ray image of a surface-mount 24-pin wafer-level quad flat package (WQFN) packaged chip.
Bottom view of the actual surface-mount 24-pin WQFN packaged chip.

Utilizzare i raggi X per rilevare gli effetti di diversi chip confezionati.

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