Le nom complet de BGA est Ball Grid Array, qui fait référence à un réseau de billes de soudure disposées sur le fond du substrat de l'emballage pour servir de bornes d'E/S connectées au circuit imprimé (PCB). Le BGA est un type de technologie d'emballage des puces, et les machines utilisées pour retravailler les puces BGA... retravailler les puces BGA is called a BGA rework station, which covers various types of packaged chips. BGA technology enhances the features of digital devices, making them compact, cost-effective, and highly functional. The BGA rework station is specifically designed to réparer les puces BGA.
1. High Success Rate in Reworking: The Silman Tech optical alignment BGA rework station achieves a success rate of up to 100% in repairing BGAs. Popular methods include full infrared, full hot air, and a combination of two hot air and one infrared. In China, the common method for BGA rework stations is to use hot air in the upper and lower parts and infrared heating at the bottom for preheating. This method effectively uses hot air to heat the upper and lower parts according to the heating wires and guides the airflow to heat the entire PCB.
2. Easy Operation: Repairing BGAs with a BGA rework station makes anyone a BGA rework expert in seconds. Fixtures for holding the PCB and PCB support brackets provide stability and support, preventing board deformation. Optical precision alignment of the screen and functions such as automatic soldering and desoldering simplify the process. Achieving proper soldering is crucial, and temperature profiling is essential for successful rework. This is where the BGA rework station differs significantly from hot air soldering guns. While hot air soldering guns can control temperature, they cannot provide real-time temperature monitoring, increasing the risk of damaging BGAs.
3. Minimal Damage to BGAs and PCBs: During BGA rework, high-temperature heating is required. Precise temperature control is crucial to prevent deviations that could lead to BGA and PCB damage. The temperature control accuracy of the BGA rework station can be within 2 degrees Celsius, ensuring the integrity of the components. This precision is unmatched by hot air soldering guns. Temperature control and prevention of board deformation are critical technical issues in successful BGA rework. By minimizing human factors, the equipment improves success rates and maintains stability.
In summary, BGA rework stations offer high success rates, easy operation, and minimal damage to components and PCBs, making them indispensable tools for BGA rework.
