Introduction to SMT X-Ray machine
An SMT X-Ray machine refers to a specialized X-ray inspection system used in the Surface-Mount Technology (SMT) industry to inspect and analyze the internal structure of electronic components and circuit boards. In the context of SMT manufacturing, the X-ray machine plays a critical role in ensuring the quality and reliability of solder joints and component placements on printed circuit boards (PCBs).
Purpose and Use:
1. Inspection of Hidden Features:
* Solder Joints: SMT components, especially those that are small or have hidden leads (e.g., BGA—Ball Grid Array, QFN—Quad Flat No-lead), can have hidden or hard-to reach solder joints. These joints can be inspected non-destructively using X-rays.
* Internal Package Structure: For components like BGAs, CSPs (Chip-on-Substrate), and other advanced packages, the X-ray machine allows inspection of the internal connections (e.g., the solder balls inside the BGA package) that cannot be seen with optical inspection methods.
2. Defect Detection:
* Cold or Open Solder Joints: The machine can detect weak solder joints that may have insufficient solder, leading to potential connection issues.
* Voids: It can identify voids or air pockets inside solder joints, which can affect electrical conductivity and reliability.
* Bridging: In the case of high-density components, the X-ray can identify solder bridges (unintended connections between two solder joints).
* Using X-ray inspections, manufacturers can optimize their soldering process to improve yield rates and reduce defects, thus saving costs associated with rework and returns.
Features to Look for in SMT X-Ray Machines:
* High Resolution: Fine resolution is crucial for detecting micro-scale defects in components like BGAs.
* Automated Inspection: Many modern systems offer automated defect detection software that can flag potential issues without human intervention.
* Real-Time Imaging: Some machines offer real-time or near-real-time imaging, which allows for faster decision-making and process adjustments.
* Quality Control: Ensures that the products meet the required standards of performance and reliability before they are sent to customers or assembled into larger systems.
SMT X-Ray machines are vital tools for inspecting advanced packaging technologies, improving manufacturing processes, and ensuring high-quality products in the electronics industry. By providing non-destructive analysis of solder joints, hidden internal connections, and other critical features, they help manufacturers identify defects early and maintain high reliability in their assemblies.
| Classification | Artikel | Type | Parameters and Functions |
|---|---|---|---|
| Hardware Configuration | X-ray Source | Brand Type | Hamamatsu, Japan, Closed Microfocus X-ray Source |
| Voltage Current | 130kv,10-300uA | ||
| Focus Size | 5μm | ||
| Maxi Power | 39W | ||
| Imaging Unit | Brand Type | iRAY,Amorphous Silicon Flat Panel Detektor | |
| Bildbereich | 130mm×130mm | ||
| Größe der lichtempfindlichen Einheit | 85μm | ||
| Pixelmatrix | 1536×1536 | ||
| Auflösung | 5.8Lp/mm | ||
| Image Frame Rate | 20fps | ||
| Tilt Angle | 0-90° viewing angle (45° to the left and right) | ||
| Magnification Ratio | Geometric magnification of 150 times | ||
| Computer | Host Brand | Advantech Industrial Computer | |
| Industrial Computer Configuration | CPU:I5 7700 RAM:8G, HDD：1TB | ||
| Monitor | 24" FHD LCD Display | ||
| Loading Platform | Loading Area | 520mm×520mm | |
| Maxi Inspection Area | 510mm×450mm | ||
| Motion Travel (Z-axis) | Detection Panel Z1=300mm，X-ray Source Z2=300mm | ||
| Motion Travel (X-axis) | X axis=510mm，Y axis=450mm | ||
| Maxi Sample Gewicht | 12kg | ||
| Movement Kontrollmethode | Joystick, Mouse, and Keyboard Tri-combination | ||
| Navigation System | Configuration | Hikvision High Definition Camera | |
| Software system | Software Introduction | Intellectual Property | Independently developed with proprietary software intellectual property. |
| Software Functions | Automatic Image Setting | Recording position coordinates and parameter information of characteristic | |
| Automatisch Navigation Functionality | Facilitate quick movement to inspection points | ||
| Calculation Feature | Capable of measuring bubbles in electronic/semiconductor products | ||
| Algorithm Model | Customizable detection algorithm models based on requirements | ||
| Location Editing Functionality | Easily achieve multi-point position detection | ||
| Machine parameters | Gewicht | Gewicht | About 1650Kg |
| Stromversorgung | Stromversorgung | 220V/50Hz | |
| Maxi Power | Maxi Power | 2.0KW | |
| Equipment Maße | Equipment Dimensions | 1400mm(L) * 1350mm(W) * 1750mm(H) | |
| Radiation Leakage Dose | Radiation Leakage Dose | < 0.5μSv / h |
