About Bga rework station usage
BGA packaging technology can be divided into five categories in detail: 1. PBGA (Plasric BGA) substrate: generally a multi-layer board composed of 2-4 layers of organic materials. In Intel series CPU, Pentium II, III, IV processors all adopt this kind of packaging form. 2. CBGA (Ceramic BGA) substrate: the ceramic substrate, the electrical connection between…