Cof bonding machine to Sri Lanka,2021.07.22
This is the Cof bonding machine ready to send to Customer in Sri Lanka,2021.07.22
This is the Cof bonding machine ready to send to Customer in Sri Lanka,2021.07.22
This is the customer from Iraqi send us the picutre,he buy the bga rework station model ST-R820,2021.07.21
This is our Cof bonding machine ready to send to Tajikistan,model ST-100WS,2021.07.20
BGA packaging technology can be divided into five categories in detail: 1. PBGA (Plasric BGA) substrate: generally a multi-layer board composed of 2-4 layers of organic materials. In Intel series CPU, Pentium II, III, IV processors all adopt this kind of packaging form. 2. CBGA (Ceramic BGA) substrate: the ceramic substrate, the electrical connection between…
This is the feedback image from our Yemen customer,he buy the cof bonding machine,Model ST-100DW
The ACF remover is a game-changer for anyone working in the LCD repair industry. This powerful solution effectively removes hardened ACF (Anisotropic Conductive Film) adhesive, a crucial step in various LCD screen repairs. Key Features of ACF Remover Safe and Efficient: Specially formulated to dissolve epoxy-based adhesives without harming delicate ITO lines on the LCD screen.…
Cof bonding machine model ST-100SS received by customer in Turkey,2021.07.14
This is the image of the cof bonding machine,ready to ship to customer is Russia,2021.07.12
This is the Cof bonding machine to Jordan,ST-100WS,2021.07.09
Multi-function operation system ①Adopt high definition human-machine interface, available for setting “set up” and “operate” to avoid error set tings, The top heater device and mounting head 2 in 1 design, leadscrew drive, Z axis controlled by Panasonic servo control system, can control the positioning precisely. With automatic identify BGA chips and mounting height; it…