- Semi-aqueous cleaning: This method utilizes organic solvents and deionized water, along with certain amounts of surfactants and additives, to form a cleaning solution. It falls between solvent cleaning and water cleaning. These cleaning agents are organic solvents with high flash points and low toxicity, ensuring safety and reliability. However, they require rinsing with water followed by drying.
- Brush cleaning machine: Specifically designed for removing flux residues after wave soldering, these machines replace manual brushing to improve cleaning efficiency and cleanliness while reducing costs. They use a unique combination of rotating brushes to thoroughly clean from multiple directions, eliminating dead spots and ensuring cleanliness. They effectively remove organic and inorganic contaminants from the surface of DIP/THT PCBA boards after soldering.
- No-clean process: This is a common alternative process where no cleaning is performed after soldering with no-clean flux or solder paste. This is particularly common in the manufacturing of mobile communication products, which are typically disposable. Solvent cleaning is primarily used to dissolve and remove contaminants. Due to its fast evaporation and strong solvency, solvent cleaning requires simple equipment.
All three cleaning techniques mentioned above can achieve a certain level of cleaning effectiveness. However, to achieve rapid and efficient cleaning of PCB boards, the application of PCBA brush cleaning machines is recommended. These machines employ multiple brushing steps to efficiently remove flux residues from the surface of PCBA after soldering, without wetting the components. The unique combination of rotating brush discs ensures thorough cleaning from multiple angles, eliminating dead spots and ensuring cleanliness. They can simultaneously work on multiple surfaces, offering high efficiency and rapid cleaning. Additionally, they effectively restore and enhance the solderability of pads and components while reducing electromagnetic interference.
