For those outside the BGA rework industry, few people know what a BGA rework station is and what its purpose is. To understand what a BGA rework station is, we first need to understand what BGA is. BGA (Ball Grid Array) is a type of chip packaging technology that enhances the performance of digital products and reduces the size of commodities through a ball grid array structure. All digital products packaged using this technology share the same characteristics: small size, strong performance, low cost, and powerful functionality.
Now that we understand what BGA is, it’s easy to comprehend what a BGA rework station is. In fact, the main purpose and working principle of a BGA rework station are to repair mechanical equipment for BGA chips. When a chip is detected to have abnormalities and requires repair, a BGA rework station is used. That’s the role of a BGA rework station.
There are several advantages to using a BGA rework station:
Firstly, it offers a high success rate for rework. For instance, the new generation optical alignment BGA rework station introduced by Silman Tech can achieve a success rate of up to 100% when repairing BGAs.
Secondly, it is easy to operate. Even novices who have never dealt with BGAs can become proficient in BGA rework in just a few minutes of learning. It doesn’t require much technical expertise; one only needs to follow the manufacturer’s training process conducted by technical engineers.
Thirdly, using a BGA rework station reduces the risk of damaging BGA chips and PCB boards.
Based on these points, we can see that the role of a BGA rework station is simply to serve as mechanical equipment for repairing chipsets on computer motherboards. Additionally, by employing practical techniques for BGA rework with a rework station, one can easily carry out rework tasks on BGA chips. When choosing a BGA rework station, it’s advisable to select one with three temperature zones and optical alignment capabilities, as this ensures a higher success rate for rework.
