Selective wave soldering is a process used for soldering electronic components. It is suitable for circuit boards that are not suitable for traditional wave soldering, such as complex circuit boards with a large number of surface mount devices (SMDs).
Here are the steps of the selective wave soldering process:
- Preparation: Firstly, identify the areas on the circuit board where soldering is required. Then, import the scanned image of the PCB into the system and edit the spray and soldering paths.
- Preheating: Place the circuit board on the conveyor belt of the selective wave soldering machine and preheat the circuit board in the preheating area to bring the solder joints to the appropriate soldering temperature.
- Flowing Wave: Move the wave soldering head over the predetermined areas on the circuit board. The wave soldering head releases molten solder, forming a wave-like solder pool.
- Soldering: Precisely place the electronic components to be soldered into the wave soldering pool. The solder in the pool connects the component terminals to the circuit board pads.
- Cooling and Solidification: After soldering is completed, the circuit board passes through a cooling area to ensure the solidification and stability of the solder joints.
Selective wave soldering process offers advantages such as high efficiency, high precision, and reduced thermal stress. It is suitable for soldering dense SMD components and complex assembly structures. However, when using this process, appropriate process parameters should be set according to the characteristics and design requirements of the circuit board to ensure soldering quality and reliability.
