IGBT modules are low-frequency, high-power electronic components consisting of IGBT (Insulated Gate Bipolar Transistor) chips and FWD (Freewheeling Diode) chips encapsulated through specific circuit bridges. Encapsulated IGBT modules are widely used in welding machines, inverters, rectifiers, electroplating power supplies, ultrasonic induction heating, USB uninterruptible power supplies, and other fields.
IGBT modules feature energy-saving and stability, serving as core devices for energy conversion and transmission. Hence, they are often referred to as the “CPU” of electronic devices in the market. Particularly with the prevailing environmental protection concept and the strategic layout of emerging industries by nations, such as rail transportation, smart grids, aerospace, and new energy, IGBT modules are gaining increasing recognition in the market.
Ensuring the detection of IGBT modules during the encapsulation process, encapsulating defective IGBT modules into subsequent processes, reducing production costs, enhancing product quality, and avoiding the use of defective IGBT modules that may lead to significant losses have become pressing issues in the industry.
X-ray inspection equipment employs the principle of X-ray transmission to detect IGBT modules, offering rapid and accurate detection without additional costs. When the X-ray inspection device transmits the IGBT module, it can directly observe the presence of defects such as bubbles inside the IGBT module and directly observe the location of the defects.
