After using reflow soldering for a period of time, a large amount of rosin flux residue from the solder paste remains on the inner walls of the reflow soldering oven chamber and the cooling zone pipes. This can reduce the heating temperature of the reflow soldering, leading to poor soldering quality. Therefore, it is necessary to disassemble and clean the inner walls of the reflow soldering oven chamber and the cooling zone regularly. Before cleaning the reflow soldering oven chamber, prepare the necessary tools, including wrenches, cleaning agents, rubber gloves, spatulas, etc.
Cleaning Steps:
- Confirm that there are no PCBA boards in the chamber, turn off the power, and wait for 60 minutes.
- When the temperature cools down to 50 degrees Celsius, disconnect the external connections of the reflow soldering oven chamber, start the pneumatic oven chamber motor, and open the chamber.
- Disassemble the components and clean them using the Silman Tech fixture cleaning machine. For the parts that are not disassembled, use a spray bottle to spray and wipe clean.
Precautions:
- Focus on cleaning the inner walls of the chamber and the cooling zone.
- Condensers, recovery pipes, and other removable parts of the reflow soldering oven should be cleaned using the Silman Tech fixture cleaning machine.
- Use non-corrosive cleaning products for chamber cleaning. Corrosive cleaning agents can cause corrosion on metal surfaces and damage equipment.
- After cleaning, air dry directly.
- Clean regularly.
