With the rapid development of mechanical equipment, manual operations are gradually being replaced. In SMT factories, manual cleaning of steel mesh has been replaced by fully automatic steel mesh cleaning machines. This not only improves efficiency but also ensures thorough cleaning, reducing time and labor costs. The emergence and application of fully automatic SMT steel…
Ultrasonic Steel Mesh Cleaning Machine: The main reasons for ultrasonic cleaning machines having certain difficult-to-control standards are: Fully Pneumatic Steel Mesh Cleaning Machine does not exhibit the above phenomena during cleaning of SMT boards, not only cleans thoroughly but also prevents potential hazards to workers from direct contact with solvents. Silman Tech Steel Mesh Cleaning…
Chips serve as the carriers of integrated circuits, cut from wafers. They are present in various electronic devices such as smartphones, laptops, smart TVs, cars, and central air conditioners. Given the high integration and precision of electronic components, traditional inspection methods often struggle to detect defects effectively. Therefore, X-ray inspection equipment is commonly used for…
With the advancement of electronic technology, there is an increasing demand for electronic products with higher functionality and smaller form factors. Electronic components are evolving towards miniaturization, integration, and multifunctionality. Ball Grid Array (BGA) components meet these requirements and are widely used, especially in high-end electronic products. When soldering BGA components, voids are inevitably generated.…
X-ray inspection equipment, also known as X-ray inspection machines or X-ray transparency testing equipment, utilizes low-energy X-rays to quickly detect internal quality and foreign objects within inspected items, displaying images of the inspected items on a computer screen. SMT-specific X-ray inspection equipment, based on X-ray transparency principles, employs X-rays for non-destructive testing. It is primarily…
The power battery market is considered one of the most promising markets. However, due to limitations in domestic technology and process levels, as well as practical capacity issues faced by battery cell enterprises, the actual capacity to meet market demand for power battery cells has not reached expectations. To mass-produce high-quality power batteries and enhance…
Recently, the 2018 Annual Conference of the Urban Passenger Transport Branch of the China Road Transport Association and the Summit Forum on the Development of Public Transport in Celebration of the 40th Anniversary of Reform and Opening Up was held in Beijing. According to Electric Knowledge, it is anticipated that by 2020, all buses in…
IGBT modules are low-frequency, high-power electronic components consisting of IGBT (Insulated Gate Bipolar Transistor) chips and FWD (Freewheeling Diode) chips encapsulated through specific circuit bridges. Encapsulated IGBT modules are widely used in welding machines, inverters, rectifiers, electroplating power supplies, ultrasonic induction heating, USB uninterruptible power supplies, and other fields. IGBT modules feature energy-saving and stability,…
BGA (Ball Grid Array) packaging, also known as ball grid array packaging, utilizes an array of solder balls arranged as pins for surface-mounted devices. There are primarily four basic types of BGAs: PBGA, CBGA, CCGA, and TBGA, with solder ball arrays serving as I/O connection points typically located on the bottom of the package. The…
With the rapid development of various smart terminal devices (such as smartphones and iPads) and electronic products for smart cars, the miniaturization of packaging and assembly, as well as various new packaging technologies, have become increasingly complex, and the quality requirements have also been elevated. The precision of circuit components is also increasing, posing higher…
