When it comes to finding reliable BGA rework station manufacturers, Shenzhen stands out as a window to the world with unparalleled competitive advantages in various fields. In the realm of PCBA board repair, as the application of BGAs continues to grow rapidly, the number of enterprises needing BGA chip repair is increasing. For purchasers of…

The functions of high-precision BGA rework stations and ordinary BGA rework stations are basically similar. The advantage of high-precision BGA rework stations over ordinary ones lies in their ability to repair highly accurate BGA chips. The main reason why ordinary BGA rework stations cannot achieve high-precision BGA rework is that they cannot reach the temperature…

With the widespread application of BGA chips, BGA reballing machines are also being adopted by more people. Where can you find BGA reballing machine manufacturers? How do you go about finding them? In fact, BGA reballing machines are relatively mature and stable equipment in the PCBA board repair industry. There are now automatic BGA reballing…

Server motherboards are widely used in various fields, and they are covered with various electronic components. If any of these components are damaged, it can render the motherboard unable to function properly. In such cases, instead of scrapping the entire motherboard, professional repair equipment is needed. One essential tool for repairing server motherboards is the…

The difference between an optical BGA rework station and a non-optical device lies in several aspects. Many people who are not familiar with rework stations may have this question. Let’s first understand what an optical BGA rework station is. Simply put, optical alignment utilizes an optical module with a prism imaging system to achieve precise…

Traditional BGA rework process involves several steps. Here’s the process: The traditional BGA rework process is complex and requires expertise. It’s recommended to use specialized equipment like Silman Tech’s BGA rework station for a more efficient and reliable process.

The full name of BGA is Ball Grid Array, which refers to an array of solder balls arranged on the bottom of the package substrate to serve as the I/O terminals connecting to the printed circuit board (PCB). BGA is a type of chip packaging technology, and the machine equipment used for reworking BGA chips…

There are several heating methods for BGA rework stations available in the market: Next, let me briefly introduce the characteristics of these three heating methods: That concludes the introduction to the heating methods for BGA rework stations. I believe you now have a good understanding of these methods. For further information, feel free to consult…