Tools and Methods for Reworking Fine-Pitch BGA Chips
Reworking fine-pitch BGA chips, typically referring to chips with adjacent BGAs spaced less than 0.5mm apart, such as Chip0201/01005 chips, presents significant challenges due to their high density. Inaccurate temperature control during rework can easily lead to damage to surrounding BGAs. So, how can we effectively remove and solder fine-pitch BGA chips? Here are the…