As everyone knows, smartphones apply glue to the chips to prevent rework. However, there are still many repair technicians who see significant business opportunities here, especially in countries where electronics work is rampant. By using technical methods to repair BGA chips in smartphones and then reusing them, considerable profits can be gained. Therefore, although it may be difficult for BGA rework stations to repair BGA chips with glue in smartphones, it still cannot stop people from pursuing profits. Many repair technicians still use BGA rework stations to repair smartphone chips. Despite the challenges and complexities, skilled technicians can handle the process. Where there is money to be made, there will always be many people flocking to it.
Repairing Apple iPhone Chips with BGA Rework Stations
Repairing the CPU chip of an Apple iPhone is a bit more cumbersome due to the presence of adhesive. First, the adhesive needs to be removed, and there is also a layer of adhesive inside the chip. Therefore, during heating, it is necessary to constantly check the temperature and the dissolution of the solder balls. The chip can only be removed when all solder balls are dissolved. Additionally, because Apple iPhones have dual-layer CPU chips, if the temperature is suitable, both chips can be removed simultaneously. If the temperature is not reached, each chip needs to be removed individually. It is important to note that due to the adhesive layer in Apple iPhones and the small size of the chips, precision and accuracy are required during disassembly, cleaning, and ball planting. However, the overall packaging is relatively straightforward.
In conclusion, as long as the technician’s skills are good and the BGA rework station’s performance is excellent, the problem can be addressed effectively.
