Can a high-precision BGA rework station repair irregularly shaped BGA chips? The first step is to understand the main reasons for irregularly shaped BGA chips. Different types of anomalies require different repair methods. Of course, if the high-precision BGA rework station you are using has a wide range of capabilities, it can indeed repair irregularly shaped BGA chips.
We must first determine the circumstances under which to repair irregularly shaped BGA chips. Typically, when using a high-precision BGA rework station, if BGA chip misalignment is detected before reflow soldering, solder paste can be applied to realign the chip. This method is used when the misalignment is not significant. However, if the misalignment is substantial, special tools are needed for repositioning. An effective method is to rely on the outline and silk screen frame for alignment. Typically, this method is seen with manual or semi-automatic high-precision BGA rework stations. However, if using a fully automatic high-precision BGA rework station, the issue of chip displacement can be avoided.
Using a high-precision BGA rework station to repair irregularly shaped BGA chips may also lead to chip abnormalities if reflow soldering is incorrectly performed. If the chip is relatively small, a hot air gun can be used for soldering. However, this method requires higher skills from the rework personnel. If not performed correctly, it may lead to unsuccessful repair of irregularly shaped BGA chips. For larger chips, a high-precision BGA rework station can be used for repair. Since high-precision BGA rework stations come with image alignment functions, they can replace manual soldering and achieve higher repair success rates compared to manual chip placement.
Therefore, a high-precision BGA rework station can indeed repair irregularly shaped BGA chips, but the method and success rate may vary depending on the circumstances and the capabilities of the equipment used.
