In order to ensure the quality of products and the reliability and stability of technical parameters in SMT process production, standardized and reputable manufacturers conduct a major cleaning of the reflow oven every month. This includes disassembling and cleaning removable parts such as condensers, fans, and filters. Resin residues and solid adhesive substances may adhere to the interior walls of the chamber and cooling zone of the reflow oven due to the operation cycles of SMT reflow and DIP wave soldering. Over time and under high temperature conditions, these residues may undergo carbonization, becoming stubborn dirt that adversely affects the performance parameters and application conditions set for the reflow oven during product processing. Therefore, regular cleaning and maintenance of such equipment (reflow and wave soldering) are often required.
Typically, at regular intervals, the reflow oven equipment requires major maintenance cleaning. This involves disassembling removable parts such as condensers, fans, and filters for cleaning. For wave soldering, filters and chain claws need to be disassembled and cleaned regularly to remove resin dirt and high-temperature carbonization.
Traditionally, in order to ensure the effective removal of dirt, solvent-based products are used to brush, spray, or coat the surfaces of the chamber and other cleaned areas. Dirt is then wiped off using brushes and cloths, and multiple rounds of cleaning with cleaning agents are carried out. However, in recent years, with advancements in product technology, a specialized chamber cleaning equipment operation process has emerged. The DEZSMART carrier cleaning machine greatly improves the cleaning effectiveness and cleaning capability, while also enhancing operational safety. Water-based cleaning agents generally have characteristics such as non-flammability and environmental friendliness, providing great convenience for cleaning and maintaining reflow ovens.
However, liquid cleaning agents can cause uneven application and flow during brushing and spraying, making it difficult to ensure sufficient time for infiltration and reaction between the cleaning agent and the dirt. As a result, the cleaning effect may not be satisfactory. This is where SMT reflow oven chamber cleaning equipment comes into play.
Silman Tech’s chamber cleaning equipment leaves the chamber surface extremely bright and clean after cleaning, greatly facilitating the operation of operators, improving efficiency, simplifying the operation process, and significantly reducing maintenance cleaning time. The mist-type water-based cleaning solution for reflow oven chamber equipment complies with the EU REACH environmental standards, demonstrating excellent environmental characteristics. It is non-flammable, has excellent safety, minimal odor, and convenient operation. It can be used for major maintenance and rapid maintenance of reflow ovens and tunnel furnaces, greatly reducing operation time and improving work efficiency. This meets the requirements of modern electronics for high-precision, high-reliability lean production, greatly enhancing equipment utilization efficiency, reducing maintenance time, simplifying maintenance operation processes, and reducing the workload of personnel.
