The difference lies in their characteristics. QFN solder paste is specially formulated to address common issues encountered during SMT assembly with QFN components, such as inadequate soldering on the side, difficulty soldering on partially oxidized PCB pads, and challenges in soldering to the component itself. It offers excellent printability, even for IC pads with a 0.3mm pitch, and features advanced moisture retention technology, ensuring prolonged tackiness and printability for up to 48 hours and 12 hours, respectively. It exhibits good wetting and soldering properties, effectively preventing soldering defects like solder bridges and false solder joints. It is adaptable to various soldering equipment requirements and offers a wide process window. The solder joints produced are bright, full, and do not require cleaning afterward, exhibiting high insulation resistance and corrosion resistance, thus ensuring high reliability. Additionally, it effectively prevents tombstoning issues with small chip components.
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