Liquid addition
Liquid addition includes three types of actions: adding cleaning solution at the beginning of the cleaning process, replenishing during the cleaning process, and replacing the cleaning solution. Considerations during liquid addition include:
- Pay attention to controlling the temperature of use. In environments below 20°C, the cleaning solution may become clear, which can adversely affect the cleaning effect.
- There is a certain amount of cleaning solution loss during the circulation cleaning process. When the level of cleaning solution in the storage tank falls below the minimum level, it needs to be replenished promptly.
- When the accumulated cleaning of the stencil reaches a certain quantity and the cleaning solution no longer meets the cleaning requirements, consider replacing the cleaning solution.
Cleaning
- The cleaning methods mainly include rotary and conveyor chain types. The cleaning time can be adjusted based on the chosen cleaning method, stencil thickness, and the objects being cleaned.
- Water-based SMT stencil cleaning agents can clean effectively at room temperature, with the optimal cleaning effect achieved when the cleaning temperature is maintained between 20-40°C.
- Select three representative stencil types for solder paste residue cleaning experiments (BGA Φ0.1～Φ0.3mm, BGA Φ0.4～Φ0.6mm, QFP 0.3mm).
Drying
The spray cleaning process generally adopts ambient temperature airflow for drying, with the drying time adjusted according to the material of the stencil.
Cleaning Effect
Water-based SMT stencil cleaning agents can effectively clean residues from small openings of SMT stencils, such as BGA Φ0.1～Φ0.3mm, and QFP 0.3mm grooves.