Selective wave soldering differs from traditional wave soldering in that it utilizes the maneuverability of small soldering nozzles to fix PCBs on a rack and then move the small soldering nozzles placed under the PCBs to come into contact with the through-hole (THT) or dual in-line package (DIP) component leads to achieve soldering. The small soldering nozzles in selective wave soldering are similar to fountains, where the molten solder flows out from the nozzles, serving as the “disturbance wave” in wave soldering, to solder the leads of traditional through-hole components. The soldering effect of selective wave soldering is significantly better than the through-hole filling rate in surface mount technology (SMT) processes, almost achieving 100% filling, without requiring components to withstand the ultra-high temperatures of reflow soldering. Here are the advantages and disadvantages of selective wave soldering:
Advantages of Selective Wave Soldering:
- No need for special fixtures or oven trays during soldering.
- Through-hole components do not require high-temperature-resistant materials; standard wave soldering conditions can be used.
- Excellent soldering quality and through-hole filling rate can be achieved during soldering.
- Energy-saving as there is no need for a large soldering furnace or a long heating zone like traditional wave soldering.
- Cost-saving as fewer solder bars are required compared to traditional wave soldering.
- The clearance area required is smaller compared to the production of oven trays for wave soldering.
- Less risk of PCB bending or deformation due to high temperatures.
- Time-saving compared to traditional wave soldering and SMT processes.
Disadvantages of Selective Wave Soldering:
- Additional equipment needs to be purchased.
- Relatively high equipment costs.
In the face of increasing difficulties in soldering through-hole components, selective wave soldering meets the changing demands of the times. It allows soldering parameters to be adjusted to optimal conditions, reducing soldering defects and potentially achieving zero soldering defects for through-hole components.
