BGA packaging is widely used in PCBA boards, and it offers several advantages and disadvantages, as detailed below:
Advantages of BGA Packaging:
- BGA packaging typically uses larger solder pads, making it easier to handle and reducing manufacturing complications. This method is one of the most robust techniques currently available, often requiring specialized equipment for removal.
- BGA packaging allows for the placement of numerous power and signal pins in the center, with I/O pins located around the periphery. In the case of miniature BGA chip packaging, all pins are neatly arranged underneath the chip without exceeding its dimensions, resulting in a tidy appearance from the bottom.
- BGA packaging employs a simple ball grid array layout that does not require advanced PCB techniques. Unlike methods like C4 and direct flip-chip packaging, which necessitate considerations for matching chip and PCB sizes and heat dissipation efficiency to prevent silicon damage, BGA packaging’s connection line matrix has sufficient mechanisms to handle heat pressure on the silicon wafer without encountering matching difficulties.
- BGA packaging is primarily designed for small device packaging and offers excellent heat dissipation performance. Experiments have shown that most of the heat generated by a silicon wafer can be transmitted downwards to the BGA ball array. Placing the silicon wafer on the bottom ensures a reasonable heat dissipation method by connecting the back of the wafer to the top of the package.
Disadvantages of BGA Packaging:
- BGA packaging requires very high reliability of solder joints, and any occurrence of open or void solder joints can lead to failure.
- The robustness of BGA packaging makes repair methods more challenging, although using Silman Tech’s BGA rework station DEZ-R820 can make repairs relatively easy.
- BGA components are highly sensitive to temperature and humidity, making precise temperature curve settings crucial during the rework process, as they directly affect the rework yield.
In conclusion, the above explanations provide insights into the advantages and disadvantages of BGA packaging. If further clarification is needed, additional information can be found through online research.