Overview
Fully automated rework system for normal SMD, BGA, QFP, CSP, sockets, Micro-SMD components etc. Support Min. SMD Size 10mm * 10mm.
ZM-R8650 BGA Rework System
- Stable and Uniform Hot Air Heating System
- Lower Heater Adjustable
- Extreme Large Carbon Fiber Infrared Pre-heater
- High-Precision PID Temperature Control System
- Industrial High-Definition CCD (2 x 5.0 MP)
- PC Control Automatic Image Recognition System
- Full Automatic Placement, Desoldering
- Built-In Pressure Testing Device To Protects The PCB
- Real-Time Temperature Monitoring and Over-Temperature Protection.
- Emergency Stop Function
| Model | ST-R850 |
|---|---|
| Total power | 6800W |
| Upper heating power | 1200W |
| Bottom heating power | 1200W |
| Bottom IR heating power | 4200W（2400W is controlled） |
| Power supply | (Single Phase) AC 220V±10 50Hz |
| Location way | Optical camera+ V-shape card slot + laser position for fast location |
| Temperature control | High precision K sensor closed loop control,independent temperature control with ±1 ℃ precision |
| Appliance selection | High sensitive touch screen + temperature control mode +Panasonic PLC +step driver |
| Max. PCB size | 570×450mm |
| Min. PCB size | 10×10mm |
| Sensor | 4units |
| Chip amplification multiple | 2-30X |
| PCB thickness | 0.5-8mm |
| Chip size | 0.3*0.6mm-80*80mm |
| Min. chip space | 0.15mm |
| Max. mount loading | 200g |
| Mount precision | ±0.01mm |
| Overall size | L670×W780×H850mm |
| Machine weight | 90KG |
