Overview
Semi-automated rework system for normal SMD, BGA, QFP, CSP, sockets, Micro-SMD components etc. Support chips size Max. 80mm x 80mm, Min. 0.5mm * 0.5mm. PCB motherboard Max. 640mm x 520mm.
The ST-R6823 SMD / BGA Rework Stations feature the latest vision and thermal process control technologies. Printed circuit boards and substrates consisting of components such as BGA’s, CSP’s, QFN’s, Flip Chips, Support P08 Small pitch LED beads, Min. 0.5mm * 0.5mm IC.
- Stable and Uniform Hot Air Heating System
- Lower Heater Adjustable
- Carbon Fiber Micro-crystalline Infrared Preheater
- External Air (N2) Supply Control System
- High-Precision PID Temperature Control System
- Automatically High-Precision Optical Alignment System
- Industrial High-Definition CCD (2.0 MP)
- HD Touch Screen HMI Interface
- Automatic Placement, Desoldering
- Built-In Pressure Testing Device To Protects The PCB
- Real-Time Temperature Monitoring and Over-Temperature Protection
- Emergency Stop Function
| Item | ZM-R6823 |
|---|---|
| Operation Mode | High Automatic / Optical / Laser / Touch Screen |
| Voltage/Power | AC380V 50/60HZ / Top:1200W, Bottom:1200W, IR: 2700W |
| Heating Mode | Top/Bottom Nozzle Hot Air, Bottom Plates Infrared |
| Material | Servo Drive( Panasonic)＋8” Touch Screen＋PLC (Panasonic) |
| PCBA Positioning | Universal Fixture + Laser Positioning |
| Temperature Precision | 2~3℃(5 Sensor Port) |
| Optical Alignment Precision | 0.01MM |
| CCD Magnification: | 5X~50X |
| For PCB Size/Chip Size | PCB Size: 640*520~10*10MM Chip Size: 1*1~80*80MM |
| Machine Dimension | L840*W960*H950(MM) |
| Net Weight | 100KG |
| Standard Wooden Packing | Packing Size: L1150*W1080*H1100(MM)/ G.W: 200KG |
- Rework Process Inspection Camera
- SMD Feeding Device
