In the BGA rework industry, professionals understand that temperature plays a crucial role during BGA rework, and the temperature profile directly affects the success rate of Rilavorazione di chip BGA. Here’s a personal suggestion from me: when setting the temperature profile for a Stazione di rilavorazione BGA, it’s advisable to start with a preheat at 190 degrees Celsius, then increase it to 250 degrees Celsius, and further raise it to 300 degrees Celsius to ensure proper soldering. Subsequently, the temperature should gradually decrease, followed by cooling for heat dissipation. This sequential heating and cooling process can reduce the risk of PCB substrate deformation caused by sudden environmental temperature changes.
The temperature and duration of each stage of the temperature profile vary depending on factors such as chip size, solder paste type, board thickness, and material. Additionally, since PCBA assemblies are typically exposed to the air, there’s significant temperature loss when heating individual areas. Therefore, temperature compensation during temperature profile setting should not rely solely on temperature increases, as excessively high ambient temperatures can damage the entire device and cause BGA bending and deformation.
In conclusion, it’s essential to set an appropriate temperature profile when using a BGA rework station to achieve the best rework results. It’s recommended to utilize a professional BGA rework station for this purpose.
