Several methods can be employed to address uneven solder paste printing on SMT stencils. SMT stencils are specialized tools used for printing circuit boards, and Surface Mount Technology (SMT) stencil technology refers to the process of assembling components without pins or short lead surface mount components on printed circuit boards or other substrates, followed by soldering and assembly through reflow soldering or wave soldering. However, uneven distribution of solder paste often occurs during the SMT assembly process. Below are specific reasons and solutions for addressing uneven solder paste printing on SMT stencils.
- The mesh walls of the SMT stencil may exhibit unevenness. In this case, utilizing electro-polishing technology is recommended to address the issue.
- Thorough cleaning is necessary after using SMT stencils to ensure there is no residue of solder paste or other impurities. The DEZ-C740 fully automatic SMT electric stencil cleaning equipment is a recommended option. Additionally, the following factors need to be considered:
- Whether the solder paste is dry or too viscous. If so, trying solder paste with a higher tin content may help.
- Pressure and peel-off speed of the squeegee during the printing process.
- If using an automatic printing machine, consider whether the amount of alcohol sprayed is excessive and whether the stencil paper is too wet after cleaning.
These are potential causes and solutions for uneven solder paste distribution during SMT stencil assembly production. We hope this information is helpful to you.
