There are generally two types of BGA soldering equipment: BGA rework stations and manual hot air rework stations. The choice depends on the user’s specific requirements.
Manual Hot Air Rework:
- Ensure cleanliness and flatness of the Saldatura BGA points.
- Apply a thin layer of solid flux evenly onto the BGA soldering pads.
- Place solder balls onto the corresponding soldering points (preferably using a fixture for convenience).
- Heat the solder balls using a hot air gun until they make contact with the soldering pads, fixing them in place.
- Remove any misplaced solder balls and reapply if necessary.
BGA Rework Station:
- Select appropriate nozzles and suction heads and set the corresponding temperature curve.
- Secure the PCB to the equipment and position the laser red dot at the center of the Chip BGA.
- Activate the rework mode and initiate the heating process.
- Once the temperature curve is completed, the machine will indicate completion, and the suction head will automatically lift the BGA chip.
- After removing the solder, place a new or re-balled BGA chip onto the soldering pads.
- Activate the soldering mode, adjust the positioning using optical alignment, and initiate the soldering process.
- Once the temperature curve is completed, the soldering process is finished.
These are the two most common types of BGA soldering equipment. Users can choose the one that best suits their needs.
