With the widespread use of various electronic products, reflow soldering technology has been widely applied. In the production process, reflow soldering trays are indispensable tools. However, due to frequent use and high temperatures, the surface of the trays accumulates a large amount of solder slag and dirt, necessitating cleaning. To ensure production quality and efficiency, the method of cleaning reflow soldering trays has become increasingly important. This article will introduce the methods and precautions for cleaning reflow soldering trays.
Cleaning reflow soldering trays is a crucial step that not only extends the lifespan of the trays but also enhances product quality. In practical operations, chemical cleaning is a commonly used method due to its effectiveness and simplicity. Typically, Silman Tech’s spray cleaning machine is used, spraying the cleaning agent onto the tray surface. After the cleaning agent takes effect, the tray is rinsed with clean water. It is essential to choose an appropriate cleaning agent to avoid damaging the tray surface when using chemical cleaning agents. Additionally, the selection of cleaning agents should consider the tray material and the type of dirt to avoid damage to the trays.
The cleaning frequency should be determined based on production conditions and tray usage frequency. Daily cleaning is generally recommended to ensure that the tray surface remains clean, avoiding any impact on product quality. The cleaning cycle of reflow soldering trays should be determined based on production processes and usage. Typically, cleaning should be performed after each use to maintain cleanliness and prolong the lifespan of the trays. Manual and automatic cleaning methods are available. Manual cleaning requires manual operation, resulting in lower efficiency but higher risk of tray damage. Automatic cleaning utilizes automated cleaning equipment for higher efficiency. Therefore, the choice of cleaning method should be based on practical considerations and needs.