There are two main methods for handling solder dross generated during soldering: chemical reduction to minimize solder dross generation and mechanical/physical extraction of solder dross. Wave soldering is a common process that generates solder dross, starting from the early days of hand-dipping solder pots. Common methods of handling solder dross include the use of solder dross reducing agents, solder dross reducing powder, and solder dross reduction machines.
Solder dross reducing powder and solder dross reducing agents are primarily used to prevent solder dross generation, serving a preventative function. Solder dross reducing powder is the most basic product, while solder dross reducing agents are more effective methods developed on the basis of solder dross reducing powder to prevent the generation of solder dross during wave soldering. However, we do not recommend using these chemical agents in selective wave soldering, as the amount of solder dross generated by this soldering method itself is minimal.
Solder dross reduction machines are physical devices used to compress the generated solder dross back into liquid solder. It should be noted that solder dross reduction machines actually only physically squeeze out the solder encapsulated by oxide in the solder dross, so it should be more accurately referred to as a solder dross separation machine. However, since the term “solder dross reduction machine” has become customary, we still use this name.
As a recommendation from selective wave soldering manufacturers, it is not advisable to use solder dross reducing powder and solder dross reducing agents because the amount of solder dross generated by selective wave soldering itself is minimal, and using these chemical agents may instead affect soldering quality. As for whether to use solder dross reduction machines, it depends on the specific situation of each factory. If exchanging with a solder factory yields better results, then using such equipment may be chosen. We hope this information is helpful to you.
