X-ray inspection equipment, also known as X-ray inspection machines ou X-ray transparency testing equipment, utilizes low-energy X-rays to quickly detect internal quality and foreign objects within inspected items, displaying images of the inspected items on a computer screen.
SMT-specific X-ray inspection equipment, based on X-ray transparency principles, employs X-rays for non-destructive testing. It is primarily used in industries such as PCBA (Printed Circuit Board Assembly), SMT assembly, semiconductor devices, batteries, automotive electronics, solar energy, LED packaging, hardware components, and wheel hubs, mainly for quality inspection of electronic products, electronic components, and accessories in factories.
The scope of X-ray non-destructive testing machines includes:
- Detection of quality in BGA (Ball Grid Array), CSP (Chip Scale Package), flip chip, COB (Chip on Board), QFN (Quad Flat No-Lead), QFP (Quad Flat Package), and PTH (Plated Through-Hole) components.
- PCB (Printed Circuit Board) soldering conditions.
- Detection of short circuits, open circuits, voids, and cold solder joints.
- IC (Integrated Circuit) package inspection.
- Inspection of components such as capacitors and resistors.
- Internal inspection of certain metal components.
- Internal inspection of electric heating tubes, lithium batteries, pearls, precision devices, and more.
Équipement d'inspection par rayons X can detect internal structural damage, inspect internal graphical structures, and determine product compliance. It is a specialized device for quality inspection in the electronics industry and finds wide applications in PCB manufacturing, electronic product processing, mounted circuit boards, electronic product packaging, battery manufacturing, aluminum casting processing, and other industries. Users can easily obtain high-quality, high-magnification, and high-resolution images of the inspected objects.
For example:
- In the semiconductor industry, X-ray inspection equipment is used for non-destructive testing of internal connections in integrated circuit packaging. With high resolution, it can detect the smallest defects on bonding wires and the bonding reaction of voids on chips when the temperature decreases.
- Detection of hidden solder joints in component assembly, such as voids, wetting defects, solder bridges, and other properties in BGA packaging, including solder quantity and solder displacement.
- In the manufacturing of multilayer printed circuit boards (SMT assembly testing), such as mobile phones, computers, PDAs, digital cameras, and mobile system base stations. The arrangement of each board surface is continuously monitored, and the X-ray system can accurately measure the structures and solder ring widths in the inner layers, which forms the basis for process optimization. Additionally, during the process of interlayer circuit metal connection, the measurement system can clearly identify short circuits and open circuits on X-ray images, determining their positions and conducting analysis.
