With the development of Surface Mount Technology (SMT), the trend towards miniaturization and high-density assembly of components has become apparent. Consequently, the nozzles of SMT pick-and-place machines have become more precise, exerting a significant influence on assembly quality. During actual assembly processes, nozzle blockages caused by solder, flux, or other contaminants can lead to misplacements. Previous methods such as using needles or ultrasonic vibration are no longer effective in resolving these issues. In response to this situation, a new type of machine de nettoyage de buses has been developed, employing innovative cleaning methods capable of swiftly removing stubborn debris from nozzles that were previously uncleanable. Moreover, the cleaning process does not damage the nozzles. Utilizing non-toxic cleaning agents contributes to a more environmentally friendly process.
Working Principle:
The next-generation fully automatic nozzle cleaning machine employs a unique mechanical design that utilizes fluid dynamics to atomize water, generating extremely fine high-pressure water mist. This mist is ejected onto the nozzles at supersonic speeds (V=360m/s), creating a powerful kinetic energy jet. An ongoing energy field is formed above the nozzle being cleaned, thoroughly disintegrating surface and internal contaminants (as the nozzles are individually placed, they are not damaged during the cleaning process). Deionized water or distilled water is automatically discharged during the cleaning process.
Functional Features:
Thoroughly resolves impurities that are difficult to clean with ultrasonic methods. Ensures effective cleaning even as nozzle apertures become increasingly smaller. Provides more thorough cleaning, thereby extending the lifespan of nozzles. Preserves the surface coatings and reflectors of nozzles without causing damage. Utilizes environmentally friendly deionized water or distilled water for cleaning. Offers automatic continuous cleaning and drying. Simplifies and streamlines operation. Applicable to various pick-and-place machines.
Economic Benefits:
Reduces the acquisition cost of nozzles. The use of the DEZ-C710 machine de nettoyage effectively resolves nozzle contamination issues, thereby extending their lifespan. Reduces unnecessary manual labor. Since the machine employs fully automatic cleaning, no dedicated personnel are required, and the entire process is automated. Effectively reduces product defect rates, thereby increasing SMT production efficiency. A significant portion of production issues are caused by surface contamination or internal dirt within the nozzles, leading to misplacements or soldering defects in subsequent processes. Using the cleaning machine ensures that the nozzles remain in a pristine condition, greatly enhancing production efficiency.
