The process of water cleaning for PCBA Le processus de nettoyage à l'eau des cartes PCBA (Printed Circuit Board Assembly) consiste à utiliser l'eau comme moyen de nettoyage, avec l'ajout de petites quantités (généralement de 2% à 10%) de substances chimiques telles que des agents tensioactifs et des inhibiteurs de corrosion. Le processus de nettoyage comprend le lavage, suivi de plusieurs rinçages avec de l'eau déionisée ou purifiée, et le séchage pour...
The advantages of water cleaning include its non-toxic nature, which does not pose health risks to workers, as well as its non-flammable and non-explosive properties, ensuring safety. Water cleaning is effective against particles, flux residues, water-soluble contaminants, and polar pollutants. It maintains good compatibility with packaging materials of components and PCB materials, preventing swelling or cracking of rubber parts and coatings. Additionally, it preserves the clarity and integrity of component surface markings and symbols. Therefore, water cleaning is one of the main processes for non-ODS (Ozone Depleting Substances) cleaning.
Water cleaning technology can be categorized into pure water cleaning and surfactant-added water cleaning processes. A typical PCBA process flow includes water with added surfactant, followed by water, pure water, ultra-pure water, hot air washing, rinsing, and drying. Ultrasonic devices are commonly used during the washing stage, and air knives (nozzles) are added during the cleaning stage. The water temperature is controlled at 60-70°C, and high water quality is required, with a resistivity ranging from 8 to 18 megohms per centimeter (MQ・cm). This alternative technology is suitable for SMT (Surface Mount Technology) assembly plants with high-volume production and requirements for product reliability. For small-batch cleaning, smaller cleaning equipment can be chosen.
