Optical Alignment System:
Utilizes high-definition CCD high-precision optical alignment system to ensure accurate component placement; the optical alignment device automatically enters and exits, equipped with fixed-point observation function for quick observation of chip corner and center alignment status.
Operation and Control System:
Features automatic soldering, desoldering, mounting, and feeding operations with one-touch operation for simplicity and convenience; equipped with laser red dot positioning to guide quick PCB positioning; multiple working modes designed for mounting system, eliminating the need for complex parameter settings; standard 10-inch high-definition touchscreen human-machine interface, configurable with multiple operation modes and customizable operation permissions; for small components, optical quick centering function is added to allow nozzles to quickly align with components, improving rework efficiency; control system adopts imported Panasonic controller to ensure precise and reliable operation.
Heating System:
Combines hot air and infrared hybrid heating methods, with upper and lower hot air heating systems designed for top and bottom alignment to ensure uniform temperature distribution; bottom large-area infrared heater adopts carbon fiber infrared heater for efficient heating and long service life, while allowing large-scale left-right movement; hot air system adopts imported centrifugal fan for quiet operation; lower hot air heating system can be manually raised and lowered, allowing for adjustable heating height at any time; utilizes high-precision K-type thermocouple closed-loop control and PID parameter self-tuning system.
Equipment Specifications:
Total Power: Max 5300W
Power Supply: AC 220V 50/60Hz
Upper Heater: 1200W
Lower Heater: 1200W
Bottom Infrared Preheater: 2700W
PCB Size: Max 415×370mm Min 10×10mm
PCB Positioning Method: V-groove and universal fixture
Temperature Control Method: K-type thermocouple, closed-loop control
Applicable Chip Size: 1×1～80×80mm
Mounting Accuracy: ±0.01mm
Equipment Dimensions: L640×W630×H900mm
Equipment Weight: Approximately 70KG
