The main function of SMT steel mesh is to accurately print solder paste onto PCB pads. During this process, some solder paste residue is inevitably left on the steel mesh, which needs to be cleaned after use to avoid affecting secondary use. In order to achieve good cleaning results and control costs, it is necessary to choose the appropriate cleaning process and cleaning agent. The cleaning processes for SMT steel mesh mainly include manual soaking and scrubbing, spray cleaning, ultrasonic cleaning, and ultrasonic combined with spray cleaning.
- Manual soaking and scrubbing method
Manual soaking and scrubbing involve immersing the SMT steel mesh in cleaning solution and manually scrubbing it. This method requires minimal initial investment and equipment but is time-consuming, labor-intensive, less effective, and may damage the steel mesh, resulting in higher production costs.
- Nettoyage par ultrasons method
Ultrasonic cleaning utilizes the cavitation effect, acceleration effect, and direct jet effect of ultrasonic waves in the liquid to directly and indirectly act on the liquid and contaminants, dispersing, emulsifying, and stripping the contaminants to achieve cleaning. However, there are significant drawbacks, such as difficulty in cleaning the mesh holes thoroughly, especially for thicker mesh boards above 2.5mm, and potential erosion of the tensioning adhesive, leading to adhesive failure and affecting the tension of the steel mesh.
- Pneumatic spray cleaning method
Spray cleaning is a form of chemical circulation cleaning, where cleaning solution is evenly sprayed onto the surface of the steel mesh. The solution interacts with the solder paste on the mesh surface, undergoing chemical reactions or dissolution, thereby removing solder paste and other impurities. The advantages of spray cleaning include easy rinsing, no dead angles, simple operation, and the ability to use pneumatic methods. The DEZ-C730 fully automatic machine de nettoyage des mailles d'acier is an example of this method.
- Ultrasonic combined with spray cleaning method
The ultrasonic combined with spray cleaning process involves positioning the ultrasonic wave source close to the mesh board and simultaneously spraying cleaning solution onto the mesh while applying ultrasonic energy to force the cleaning solution into the mesh holes to remove residues. This cleaning process yields excellent results, especially for cleaning red glue and thick mesh boards, but requires higher initial investment costs. The DEZ-C750L red glue screen cleaning machine is an example of this method.
