COF (Chip-On-Film) bonding machines are used to attach semiconductor chips to flexible substrates, and the adhesive commonly used is ACF (Anisotropic Conductive Film). Here is a simple overview of how it works:
Preparation: The patch and film are cleaned and ensure good adhesion between the patch and the film. This may include removing any contaminants and ensuring a smooth surface.
Alignment: The chip is precisely aligned to the film using a positioning system. Accurate alignment is key to the best electrical connection.
Bonding process: This machine heats or pressurizes the chip and film interface. This activates the adhesive, allowing it to bond the chip to the substrate. This process includes:
Thermal bonding: Utilizes heat to activate thermoplastic adhesives.
Pressure bonding: Apply pressure to enhance adhesion without having to heat.
Cooling and curing: Once bonding is complete, the assembly is cooled to allow the adhesive to cure and reach its final strength.
Testing and inspection: The bonded assembly is tested to ensure quality, including checking the bond strength and electrical connection.
COF technology is commonly used in displays, flexible displays, sensors, and various electronic devices to achieve thinner and lighter designs. It is a very important technology for modern electronics. If you would like to learn more about any part of the process or have specific questions about COF bonding machines, please feel free to contact us to help you.
